Technical Specificatios
Chemical Composition of Copper:
| Material | Normal Composition | Nearest Relevant Composition Specification | ||
| BS:2870 | ISO | JIS | ||
| Electrolytic Tough Pitch H.C. Copper | 99.92% Min. Cu | C 101 | Cu ETP 1337 | H 3100 C 2100 |
| Phosphorous Deoxidized Copper (DONA) | 99.90% Min. Cu P.0.0134-0.05 | C 106 | Cu DHP 1337 | H 3100 C 1220 |
Specifications:
| Material | Tensile temper strength elongation N/mm% on 50 mm | Vickers Hardness | Complies with or falls within ISO | JIS | |||
| 'O' | 210 Min 35 Min | 55 Max | |||||
| Electrolytic Tough | M | 210 Min 35 Min | 65 Min | Cu ETP | H 3100 | ||
| Pitch H.C. Copper | H | 240 Min 10 Min | 70 to 95 | ISO : 1337 | C 1100 | ||
| H | 290 Min | 90 Min | |||||
| 'O' | 210 Min 35 Min | 55 Max | |||||
| Phosphorous | M | 210 Min 35 Min | 65 Min | Cu DHP | H 3100 | ||
| Deoxidised Copper | H | 240 Min 10 Min | 70 to 95 | ISO : 1337 | C 1220 | ||
| H | 290 Min | 90 Min | |||||
- 'O' : Annealed Condition
- M : 1/4 Hard
- 1/2 : Half Hard
- H : Full Hard
- * : Electrical conductivity at 20. Cel(% IACS) - 100-101 (For Cu ETP 'O' temper)
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